lvir3333/s191-pf doc. no : qw0905- rev. : date : - 2008 data sheet ligitek electronics co.,ltd. property of ligitek only infrared emitting diodes lvir3333/s191-pf 08 - oct. a lead-free parts pb
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions ligitek electronics co.,ltd. property of ligitek only water clear gaaias/gaas lvir3333/s191-pf part no device selection guide: lens color material features: 1. high radiant intensity. 2. suitable for pulsed applications. 3. low average degradation. descriptions: the lvir3333/s191-pfseries are high power solution grown efficiency gallium arsenide infrared emitting diodes encapsulated in water clear plastic part no. lvir3333/s191-pf 1/7 page t-1 3/4 package individually - + 2.54typ ? 0.5 typ 2.7 0.5 5.75 0.5 5.9 5.0 7.6 8.6
electrical optical characteristics (aa=25) ligitek electronics co.,ltd. property of ligitek only symbol ratings parameter operating temperature storage temperature -40 ~ +85 -40 ~ +85 t opr tstg peak forward current (300pps,10 s pulse) reverse voltage forward current power dissipation vr i f pd i fp absolute maximum ratings at ta=25 unit v ma mw a note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the radiant intensity data did not including 15% testing tolerance. vir 5 50 1 100 radiant intensity aperture radiant incidence peak emission wavelength spectral line half width forward voltage reverse current viewing angle parametersymbol unittest condition if=20ma lemw/sr eemw/cm peak nm nm vr=5v vfv ir a 2 1/2 deg 2 if=20ma if=20ma if=20ma if=20ma min. typ. max. 6.010 0.861.43 940 50 1.21.6 100 30 page2/7 electrostatic discharge esd 2000 v lvir3333/s191-pf part no.
2.5 i fdc [ma] 40 ambient temperature [ ] fig.5 forward dc voltage vs. temperature fig 3. relative radiant power vs. forward peak current forward voltage[v] typical electro-optical characteristics curve f o r w a r d d c v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -20 -40020 0.9 0.8 1.0 10 1.0 1.1 1.2 r e l a t i v e r a d i a n t p o w e r n o r m a l i z e d @ 2 0 m a 0.1 1.0 10.0 10 f o r w a r d c u r r e n t [ m a ] 1.0 0.1 0.5 1.0 1.5 2.0 vir chip 100 1000 fig.4 relative radiant power vs. forward peak current r e l a t i v e r a d i a n t p o w e r @ 2 0 m a , n o r m a l i z e @ 2 5 80 ambient temperature [ ] 1.0 1.5 0.5 6080100 60 2040 -200 -40 0 100 fig.6 relative radiant power vs. temperature 100 100 10 3.0 2.0 2.5 i fpk [ma] 10.0 1.0 0.1 r e l a t i v e r a d i a n t p o w e r n o r m a l i z e d @ 1 0 0 m a 1000 page3/7 1050 0.5 r e l a t i v e r a d i a n t i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.5 3.0 4.0 0.0 wavelength[nm] 900 850 800 1000 950 1.0 1100 ligitek electronics co.,ltd. property of ligitek only fig.2 relative radian intensity vs.wavelength fig.1 forward current vs. dc forward voltage lvir3333/s191-pf part no.
circuit model a (a) recommended circuit. (b) the difference of brightness between led could be found due to the vf-if characteristics of led. drive method: led is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. this current limiting typically takes the form of a current limiting resistor placed in series with the led. consider worst case voltage variations than could occur across the current limiting resistor. the forwrd current should not be allowed to change by more than 40% of its desired value. storage time: 1.the operation of temperatures and rh are : 5 ~35 ,rh<60%. 2.once the package is opened, the products should be used within a week. otherwise, they should be kept in a damp proof box with descanting agent. considering the tape life, we suggest our customers to use our products within a year(from production date). 3.if opened more than one week in an atmosphere 5 ~ 35 ,rh<60%, they should be treated at 60 5 fo r 15hrs. esd(electrostatic discharge): static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. cleaning: use alcohol-based cleaning solvents such as isopropyl alcohol to clean the led. circuit model b led led ligitek electronics co.,ltd. property of ligitek only page 4/7 lvir3333/s191-pf part no.
anode side(cathode side on gaalas chips) 15 45 ligitek electronics co.,ltd. property of ligitek only 2. the led lamps are designed for high-density mount- ing and have a structure which can alleviate mechan- ical stress due to clinching . nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . mounting: 1. if the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. for this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (o) (o) (x) page 5/7 lvir3333/s191-pf part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max preheat 0 0 25 2 /sec max 50 time(sec) 100 150 260 temp( c) 5 /sec max 260 c3sec max soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only page 6/7 lvir3333/s191-pf part no.
reliability test: operating life test test item low temperature storage test high temperature storage test thermal shock test high temperature high humidity test solder resistance test solderability test this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition 1.ta=85 5 2.t=1000 hrs (-24hrs, +72hrs) jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 reference standard mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only 7/7 page lvir3333/s191-pf part no.
|
